NONLINEAR VIBRATION OF RING SECTOR PLATES

Piezoelectric Actuators for Functionally Graded Plates- Nonlinear Vibration Analysis

Free Vibration Analysis of Nonlinear Circular Plates Resting on Winkler and Pasternak Foundations

Dynamic behaviour of nonlinear free vibration of circular plate resting on two-parameters foundation is studied. The governing ordinary differential equation is solved analytically using hybrid Laplace Adomian decomposition method. The analytical solutions obtained are verified with existing results in literature. The analytical solutions are used to determine the influence of elastic fou...

Temperature Effects on Nonlinear Vibration of FGM Plates Coupled with Piezoelectric Actuators

An analytical solution for a sandwich circular FGM plate coupled with piezoelectric layers under one-dimension heat conduction is presented in this paper. A nonlinear static problem is solved first to determine the initial stress state and pre-vibration deformations. By adding an incremental dynamic state to the pre-vibration state, the differential equations are derived. The role of thermal en...

Nonlinear Magneto-Nonlocal Vibration Analysis of Coupled Piezoelectric Micro-Plates Reinforced with Agglomerated CNTs

The aim of this article is to analyze nonlinear electro-magneto vibration of a double-piezoelectric composite microplate-system (DPCMPS) pursuant to the nonlocal piezoelasticity theory. The two microplates are assumed to be connected by an enclosing elastic medium, which is simulated by the Pasternak foundation. Both of piezoelectric composite microplates are made of poly-vinylidene fluoride (P...

Thermally Induced Vibration, Circular Plates

1. Tummala RR (2001) Fundamentals of microsystems packaging. McGraw-Hill International Edition, New York 2. JEDEC (2002) Design standard: design requirements for outlines of solid state and related products; JEDEC Publication 95, Design Guide 4.14-1/D, Ball Grid Array Package, JEDEC Solid State Technology Association 3. Vujosevic M (2006) Warpage of flip chip packages. In: Proceedings of IMECE2...